Electronic device

ABSTRACT

An electronic device includes: a display panel having an active area in which a plurality of pixels are disposed and a peripheral area disposed around the active area; a plurality of sensing electrodes disposed in the active area; and a first sensing line connected to one of the plurality of sensing electrodes and including a first portion disposed in the peripheral area, a second portion extending from the first portion and disposed in the active area, and a third portion extending from the second portion and disposed in the peripheral area.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2020-0044862, which is hereby incorporated byreference for all purposes as if fully set forth herein.

BACKGROUND Field

Example implementations of the present disclosure relate generally to anelectronic device and more specifically, to an electronic deviceincluding a display panel and a sensor.

Discussion of the Background

An electronic device includes an active area that is activated accordingto an electrical signal. The electronic device may sense an inputapplied from the outside through the active area and simultaneouslydisplay various images to provide information to a user. In recentyears, as electronic devices having various shapes are developed, activeareas having various shapes have been implanted in the electronicdevices.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Applicant has realized that as a peripheral area of an electronic devicehaving a sensor is decreased, and an active area of the electronicdevice is increased, there is insufficient area for forming a pluralityof sensing lines of the sensor in the peripheral area of the electronicdevice.

Electronic devices having a sensor constructed according to theprinciples and example implementations of the present disclosure arecapable of providing the sensor having improved sensing sensitivity byforming a plurality of sensing lines of the sensor in an active area ofthe electronic devices.

In addition, electronic devices constructed according to the principlesand example implementations of the present disclosure include a displaypanel having a reduced peripheral area and a sensor disposed on thedisplay panel.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to an example embodiment, an electronic device includes: adisplay panel having an active area in which a plurality of pixels aredisposed and a peripheral area disposed around the active area; aplurality of sensing electrodes disposed in the active area; and a firstsensing line connected to one of the plurality of sensing electrodes andincluding a first portion disposed in the peripheral area, a secondportion extending from the first portion and disposed in the activearea, and a third portion extending from the second portion and disposedin the peripheral area.

The electronic device may further include a second sensing lineconnected to another of the plurality of sensing electrodes andincluding a fourth portion disposed in the peripheral area, a fifthportion extending from the fourth portion and disposed in the activearea, and a sixth portion extending from the fifth portion and disposedin the peripheral area, wherein the fourth portion of the second sensingline in the active area may be closer to the peripheral area than thesecond portion of the first sensing line in the active area when viewedin plane.

The second portion of the first sensing line in the active area may havea length greater than that of the fifth portion of the second sensingline in the active area.

The second portion of the first sensing line in the active area may havea width less than that of the fifth portion of the second sensing linein the active area.

The second portion of the first sensing line in the active area may haveresistance greater than that of the fifth portion of the second sensingline in the active area.

Each of the second portion of the first sensing line in the active areaand the fifth portion of the second sensing line in the active area mayhave a mesh structure.

A mesh line of the second portion of the first sensing line in theactive area may have a width equal to or less than that of a mesh lineof the fifth portion of the second sensing line in the active area.

Each of the plurality of sensing electrodes may include a plurality ofsensing patterns and a plurality of connection patterns, and the secondportion of the first sensing line in the active area and the pluralityof sensing patterns may be disposed on a same layer and may include asame material.

The electronic device may further include a dummy electrode disposedbetween the second portion of the first sensing line in the active areaand the plurality of sensing patterns.

Each of the plurality of sensing electrodes may include a plurality ofsensing patterns and a plurality of connection patterns, and the secondportion of the first sensing line in the active area may be disposed ata different level from the plurality of sensing patterns in across-sectional view.

A boundary may be disposed between the active area and the peripheralarea, and the boundary may include a partially curved boundary.

The second portion of the first sensing line in the active area may bespaced apart from the peripheral area by the partially curved boundarytherebetween when viewed in plane.

The electronic device may further include a second sensing lineconnected to another of the plurality of sensing electrodes and spacedapart from the second portion by the partially curved boundarytherebetween.

The display panel may be bent with respect to: a first bending axisextending in a first direction; a second bending axis extending in thefirst direction and spaced apart from the first bending axis in a seconddirection intersecting the first direction; a third bending axisextending in the second direction; and a fourth bending axis extendingin the second direction and spaced apart from the third bending axis inthe first direction, wherein the active area may overlap the firstbending axis, the second bending axis, the third bending axis, and thefourth bending axis when viewed in plane.

According to another example embodiment, an electronic device includes:a display panel having an active area configured to display an image, aperipheral area disposed around the active area, and a partially curvedboundary between the active area and the peripheral area; and a sensorincluding a plurality of sensing electrodes disposed in the active areaand a plurality of sensing lines electrically connected to the pluralityof sensing electrodes, respectively, wherein: the plurality of sensinglines include a first sensing line electrically connected to one of theplurality of sensing electrodes, and a connection portion of the firstsensing line is spaced apart from the peripheral area by the partiallycurved boundary therebetween when viewed in plane.

The plurality of sensing lines may further include a second sensing lineelectrically connected to another of the plurality of sensingelectrodes, a connection portion of the second sensing line may bedisposed between the partially curved boundary and the connectionportion of the first sensing line when viewed in plane, and theconnection portion of the second sensing line may have a resistancevalue less than that of the connection portion of the first sensingline.

The connection portion of the first sensing line may have a lengthgreater than that of the connection portion of the second sensing line.

The connection portion of the first sensing line may have a width lessthan that of the connection portion of the second sensing line.

Each of the connection portion of the first sensing line and theconnection portion of the second sensing line may have a mesh structure,and a mesh line of the connection portion of the first sensing line mayhave a width equal to or less than that of a mesh line of the connectionportion of the second sensing line.

Each of the plurality of sensing electrodes may include a plurality ofsensing patterns and a plurality of connection patterns, and theconnection portion of the first sensing line, the connection portion ofthe second sensing line, and the plurality of sensing electrodes may bedisposed on a same layer or are disposed at different levels in across-sectional view.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the present disclosure asclaimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the present disclosure and are incorporated in andconstitute a part of this specification, illustrate example embodimentsof the present disclosure, and together with the description serve toexplain the inventive concepts.

FIG. 1A is a perspective view of an example embodiment of an electronicdevice constructed according to an embodiment of the present disclosure.

FIG. 1B is a perspective view of another example embodiment of anelectronic device constructed according to an embodiment of the presentdisclosure.

FIG. 2 is a cross-sectional view illustrating a partial configuration ofthe electronic device of FIG. 1A or 1B.

FIG. 3 is a plan view of a display panel of FIG. 2.

FIG. 4 is a cross-sectional view illustrating the display panel of FIG.2.

FIG. 5 is a plan view of an example embodiment of a sensor of FIG. 2.

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 5.

FIG. 7A is an enlarged plan view of area AA′ of FIG. 5.

FIG. 7B is an enlarged plan view of area BB′ of FIG. 7A.

FIG. 8A is an enlarged plan view of area CC′ in FIG. 5 illustrating anexample embodiment of sensing lines and sensing electrodes of FIG. 5.

FIG. 8B is an enlarged plan view of area CC′ in FIG. 5 illustratinganother example embodiment of the sensing lines and the sensingelectrodes of FIG. 5.

FIG. 9 is an enlarged plan view of area DD′ of FIG. 8A.

FIG. 10 is an enlarged plan view of area EE′ of FIG. 8A.

FIG. 11A is an enlarged plan view of area FF′ in FIG. 8A illustrating anexample embodiment of the sensing lines of FIG. 8A.

FIG. 11B is an enlarged plan view of an area corresponding to area FF′in FIG. 8A illustrating another example embodiment of the sensing linesof FIG. 8A.

FIG. 11C is an enlarged plan view of an area corresponding to area FF′in FIG. 8A illustrating another example embodiment of the sensing linesof FIG. 8A.

FIG. 11D is an enlarged plan view of an area corresponding to area FF′in FIG. 8A illustrating another example embodiment of the sensing linesof FIG. 8A.

FIG. 12 is a plan view of another example embodiment of the sensor ofFIG. 2.

FIG. 13 is a cross-sectional view taken along line II-II′ of FIG. 12.

FIG. 14 is a plan view of another example embodiment of the sensor ofFIG. 2.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various example embodiments or implementations of thepresent disclosure. As used herein “embodiments” and “implementations”are interchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various example embodiments may bepracticed without these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areshown in block diagram form in order to avoid unnecessarily obscuringvarious example embodiments. Further, various example embodiments may bedifferent, but do not have to be exclusive. For example, specificshapes, configurations, and characteristics of an example embodiment maybe used or implemented in another example embodiment without departingfrom the inventive concepts.

Unless otherwise specified, the illustrated example embodiments are tobe understood as providing example features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexample embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, such as the x, y, and z-axes, and may beinterpreted in a broader sense. For example, the DR1-axis, the DR2-axis,and the DR3-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. For thepurposes of this disclosure, “at least one of X, Y, and Z” and “at leastone selected from the group consisting of X, Y, and Z” may be construedas X only, Y only, Z only, or any combination of two or more of X, Y,and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exampleterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various example embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized example embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, example embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1A is a perspective view of an example embodiment of an electronicdevice constructed according to an embodiment of the present disclosure.

Referring to FIG. 1A, an electronic device 1000 may be activatedaccording to an electrical signal. For example, the electronic device1000 may be, e.g., a mobile phone, a tablet computer, a navigation unit,a game console, or a wearable device, but example embodiments are notlimited thereto. FIG. 1A exemplarily illustrates that the electronicdevice 1000 is a mobile phone.

The electronic device 1000 may display an image through an active area1000A. The active area 1000A may have a shape bent with respect to fourbending axes BA1, BA2, BA3, and BA4.

The active area 1000A may include a main display surface 1000A1 andcurved surfaces 1000A2, 1000A3, 1000A4, and 1000A5 bent while extendingfrom the main display surface 1000A1. The main display surface 1000A1may have a rectangular shape substantially parallel to a plane definedby a first direction DR1 and a second direction DR2. The bent curvedsurfaces 1000A2, 1000A3, 1000A4, and 1000A5 may be bent while extendingfrom four sides of the main display surface 1000A1, respectively.

The curved surfaces 1000A2, 1000A3, 1000A4, and 1000A5 may include afirst curved surface 1000A2, a second curved surface 1000A3, a thirdcurved surface 1000A4, and a fourth curved surface 1000A5. The firstcurved surface 1000A2 and the second curved surface 1000A3 may be spacedapart from each other in the first direction DR1 by the main displaysurface 1000A1 therebetween, and the third curved surface 1000A4 and thefourth curved surface 1000A5 may be spaced apart from each other in thesecond direction DR2 by the main display surface 1000A1 therebetween.

Each of the first and second bending axes BA1 and BA2 may extend alongthe first direction DR1, and each of the third and fourth bending axesBA3 and BA4 may extend along the second direction DR2. The first curvedsurface 1000A2 may extend from the main display surface 1000A1 and bebent with respect to the third bending axis BA3. The second curvedsurface 1000A3 may extend from the main display surface 1000A1 and bebent with respect to the fourth bending axis BA4. The third curvedsurface 1000A4 may extend from the main display surface 1000A1 and bebent with respect to the first bending axis BA1. The fourth curvedsurface 1000A5 may extend from the main display surface 1000A1 and bebent with respect to the second bending axis BA2.

The electronic device 1000 may have a thickness direction that issubstantially parallel to a third direction DR3 intersecting the firstdirection DR1 and the second direction DR2. Thus, a front surface (e.g.,a top surface) and a rear surface (e.g., a bottom surface) of members ofthe electronic device 1000 may be defined with respect to the thirddirection DR3. In this specification, a feature of when viewed in planeor on plane may represent a feature of when viewed in a directionparallel to the third direction DR3.

FIG. 1B is a perspective view of another example embodiment of anelectronic device constructed according to an embodiment of the presentdisclosure.

Referring to FIG. 1B, an active area 1000Aa of an electronic device1000-A may include a main display surface 1000A1 and curved surfaces1000A2 and 1000A3 bent while extending from two sides, which face eachother, of the main display surface 1000A1, respectively. For example,the active area 1000Aa may include the main display surface 1000A1, afirst curved surface 1000A2, and a second curved surface 1000A3.

For example, the active area 1000A and 1000Aa of the electronic device1000 and 1000-A includes a plurality of curved surfaces as an example ineach of FIGS. 1A and 1B, but example embodiments are not limitedthereto. For example, the active area 1000Aa may include only the maindisplay surface 1000A1. For example, the active area 1000Aa may includethe main display surface 1000A1 and only one curved surface or threecurved surfaces.

FIG. 2 is a cross-sectional view of a partial configuration of theelectronic device of FIG. 1A or 1B.

Referring to FIG. 2, the electronic device 1000 may include a displaypanel 100 and a sensor 200.

The display panel 100 may be a component that substantially generates animage. The display panel 100 may be a light emitting display panel. Forexample, the display panel 100 may be an organic light emitting displaypanel, a quantum dot light emitting display panel, a micro-LED displaypanel, or a nano-LED display panel. Alternatively, the display panel 100may be a light receiving display panel. For example, the display panel100 may be a liquid crystal display panel.

The sensor 200 may be disposed on the display panel 100. The sensor 200may sense an external input applied from the outside. The external inputmay be an input of a user. For example, the input of the user mayinclude various types of external inputs such as a portion of a user'sbody, light, heat, a pen, or pressure.

The sensor 200 may be provided on the display panel 100 through acontinuous process. In this case, the sensor 200 may be directlydisposed on the display panel 100. For example, a feature of being“directly disposed” means that an additional member is not disposedbetween the sensor 200 and the display panel 100. For example, anadditional adhesive member may not be disposed between the sensor 200and the display panel 100.

Alternatively, the sensor 200 may be coupled with the display panel 100through an adhesive member. The adhesive member may include a typicaladhesive or sticking agent.

For example, the adhesive member may be a transparent adhesive membersuch as a pressure sensitive adhesive film (PSA), an optically clearadhesive film (OCA), or an optically clear resin (OCR).

For example, the electronic device 1000 may further include a windowdisposed on the sensor 200. The window may include an optically clearinsulating material, e.g., glass or plastic. The window may have asingle-layer structure or a multi-layer structure.

FIG. 3 is a plan view of a display panel of FIG. 2.

Referring to FIG. 3, an active area 100A and a peripheral area 100N maybe defined on the display panel 100. The active area 100A may beactivated according to an electrical signal. For example, the activearea 100A may display an image. The peripheral area 100N may surroundthe active area 100A. A driving circuit or a driving line for drivingthe active area 100A may be disposed in the peripheral area 100N.

A boundary 100BA may be defined between the active area 100A and theperipheral area 100N. The boundary 100BA may include first, second,third, and fourth partial boundaries 100BAP1, 100BAP2, 100BAP3, and100BAP4 each having a finite radius of curvature. For example, the radiiof the first, second, third, and fourth partial boundaries 100BAP1,100BAP2, 100BAP3, and 100BAP4 may be different from each other. Forexample, the radii of the first, second, third, and fourth partialboundaries 100BAP1, 100BAP2, 100BAP3, and 100BAP4 may be same as eachother. The third partial boundary 100BAP3 and the fourth partialboundary 100BAP4 may be closer to a plurality of sensing pads 160 thanthe first partial boundary 100BAP1 and the second partial boundary100BAP2. For example, the first, second, third, and fourth partialboundaries 100BAP1, 100BAP2, 100BAP3, and 100BAP4 may be partiallycurved boundaries of the boundary 100BA. For example, the first, second,third, and fourth partial boundaries 100BAP1, 100BAP2, 100BAP3, and100BAP4 may be disposed at corners of the boundary 100BA.

The first, second, third, and fourth bending axes BA1, BA2, BA3, and BA4may overlap the active area 100A. A first point P1 at which the firstbending axis BA1 intersects the third bending axis BA3, a second pointP2 at which the first bending axis BA1 intersects the fourth bendingaxis BA4, a third point P3 at which the second bending axis BA2intersects the third bending axis BA3, and a fourth point P4 at whichthe second bending axis BA2 intersects the fourth bending axis BA4 maybe defined in the active area 100A.

The first point P1 may be adjacent to the first partial boundary100BAP1, the second point P2 may be adjacent to the second partialboundary 100BAP2, the third point P3 may be adjacent to the thirdpartial boundary 100BAP3, and fourth point P4 may be adjacent to thefourth partial boundary 100BAP4.

In an example embodiment, when the display panel 100 is bent withrespect to the first, second, third, and fourth bending axes BA1, BA2,BA3, and BA4, an area of the peripheral area 100N adjacent to the first,second, third, and fourth partial boundaries 100BAP1, 100BAP2, 100BAP3,and 100BAP4 may be decreased as compared to a case of when the displaypanel 100 is not bent.

The display panel 100 may include a base layer 100-1, a plurality ofpixels 110, a plurality of signal lines 120, 130, and 140, a pluralityof display pads 150, and a plurality of sensing pads 160.

The base layer 100-1 may include a synthetic resin film. The syntheticresin film may include a thermosetting resin. The base layer 100-1 mayhave a multi-layer structure. For example, the base layer 100-1 may havea three-layer structure of a synthetic resin layer, an adhesive layer,and a synthetic resin layer. For example, the synthetic resin layer mayinclude a polyimide-based resin layer, but example embodiments are notlimited thereto. The synthetic resin layer may include at least one ofan acrylic-based resin, a methacrylic-based resin, a polyisoprene-basedresin, a vinyl-based resin, an epoxy-based resin, a urethane-basedresin, a cellulose-based resin, a siloxane-based resin, apolyamide-based resin, and a perylene-based resin. For example, the baselayer 100-1 may include a glass substrate or an organic/inorganiccomposite substrate.

The pixels 110 may be disposed in the active area 100A. The signal lines120, 130, and 140 are connected to the pixels 110 and transmitelectrical signals to the pixels 110. Referring to FIG. 3, the signallines 120, 130, and 140 include a data line 120, a scan line 130, and apower line 140. However, example embodiments are not limited thereto.For example, the signal lines 120, 130, and 140 may further include atleast one of an initialization voltage line and a light emitting controlline.

Each of the pixels 110 may include a pixel circuit and a light emittingelement. The pixel circuit may include at least one transistor and atleast one capacitor. The light emitting element may include an organiclight emitting diode, a micro-sized light emitting diode, or anano-sized light emitting diode.

The display pads 150 may include a first pad 151 and a second pad 152.The first pad 151 may be provided in plurality, and the plurality offirst pads 151 may be connected to the data lines 120, respectively. Thesecond pad 152 may be electrically connected to the power line 140. Forexample, the second pad 152 may be electrically connected to the powerline 140 through a power pattern.

The display panel 100 may provide electrical signals, which are providedfrom the outside through the display pads 150, to the pixels 110. Forexample, the display pads 150 may further include pads for receivingother electrical signals in addition to the first pad 151 and the secondpad 152. However, example embodiments are not limited thereto.

A driving chip 300 may be mounted in the peripheral area 100N of thedisplay panel 100. The driving chip 300 may be a chip-type timingcontrol circuit and/or may include a processor. In this case, the datalines 120 may be electrically connected to the first pads 151 throughthe driving chip 300. However, example embodiments are not limitedthereto. For example, the driving chip 300 may be mounted on a filmseparated from the display panel 100. In this case, the driving chip 300may be electrically connected to the display pads 150 through the film.

The plurality of sensing pads 160 may be electrically connected tosensing electrodes of the sensor, which will be described later. Amongthe plurality of sensing pads 160, some sensing pads and other sensingpads may be spaced apart from each other by the display pads 150therebetween. However, example embodiments are not limited thereto. Anarrangement relationship between the sensing pads 160 and the displaypads 150 may be variously changed.

FIG. 4 is a cross-sectional view illustrating the display panel of FIG.2.

Referring to FIG. 4, the display panel 100 may include a plurality ofinsulation layers, a semiconductor pattern, a conductive pattern, and asignal line. An insulation layer, a semiconductor layer, and aconductive layer are provided by a method such as coating or deposition.Thereafter, the insulation layer, the semiconductor layer, and theconductive layer may be selectively patterned by a photolithographymethod. Through the above-described method, the semiconductor pattern,the conductive pattern, the signal line, etc., formed in a circuit layer100-2 and a display element layer 100-3 are provided. Thereafter, anencapsulation layer 100-4 covering the display element layer 100-3 maybe provided.

At least one inorganic layer is provided on a top surface of the baselayer 100-1. The inorganic layer may include at least one of an aluminumoxide, a titanium oxide, a silicon oxide, a silicon oxynitride, azirconium oxide, and a hafnium oxide. The inorganic layer may havemultiple layers. The multi-layered inorganic layers may provide abarrier layer and/or a buffer layer. In the example embodiment, thedisplay panel 100 includes a buffer layer BFL.

The buffer layer BFL improves a coupling force between the base layer100-1 and the semiconductor pattern. The buffer layer BFL may include asilicon oxide layer and a silicon nitride layer, and the silicon oxidelayer and the silicon nitride layer may be alternately laminated witheach other.

The semiconductor pattern may be disposed on the buffer layer BFL. Thesemiconductor pattern may include polysilicon. However, exampleembodiments are not limited thereto. For example, the semiconductorpattern may include amorphous silicon or oxide semiconductor.

FIG. 4 merely illustrates a portion of the semiconductor pattern, andthe semiconductor pattern may be further disposed on another area. Thesemiconductor pattern may be arranged over the pixels 110 (refer to FIG.3) based on a particular rule. The semiconductor pattern may have anelectrical property that is different according to whether doped or nottherein. The semiconductor pattern may include a doped area and anon-doped area. The doped area may be doped with an n-type dopant or ap-type dopant. A p-type transistor may include a doped area that isdoped with the p-type dopant, and an n-type transistor may include adoped area that is doped with the n-type dopant.

The doped area may have a conductivity greater than that of thenon-doped area and substantially serve as an electrode or a signal line.The non-doped area substantially corresponds to an active (e.g.,channel) of the transistor. In other words, one portion of thesemiconductor pattern may be the active of the transistor, anotherportion may be a source or a drain of the transistor, and anotherportion may be a connection electrode or a connection signal line.

Each of the pixels 110 (refer to FIG. 3) may have an equivalent circuitincluding seven transistors, one capacitor, and a light emittingelement, and the equivalent circuit of the pixel 110 may be changed invarious ways. Referring to FIG. 4, each of the pixels may include onetransistor 111 and one light emitting element 112.

A source S1, an active A1, and a drain D1 of the transistor 111 may beformed in the semiconductor pattern. The source S1 and the drain D1 mayextend from the active A1 in opposite directions in a cross-sectionview. Referring to FIG. 4, a portion of a connection signal line SCL maybe provided from the semiconductor pattern. For example, the connectionsignal line SCL may be connected to the drain D1 of the transistor 111on a plane.

A first insulation layer 10 may be disposed on the buffer layer BFL. Thefirst insulation layer 10 may overlap the plurality of pixels 110 incommon and cover the semiconductor pattern. The first insulation layer10 may be an inorganic layer and/or an organic layer and have asingle-layer or multi-layer structure. The first insulation layer 10 mayinclude at least one of an aluminum oxide, a titanium oxide, a siliconoxide, a silicon oxynitride, a zirconium oxide, and a hafnium oxide. Inthe example embodiment, the first insulation layer 10 may be asingle-layered silicon oxide layer. In addition to the first insulationlayer 10, an insulation layer of the circuit layer 100-2, which will bedescribed later, may be an inorganic layer and/or an organic layer andhave a single-layer or multi-layer structure. For example, the inorganiclayer may include at least one of an aluminum oxide, a titanium oxide, asilicon oxide, a silicon oxynitride, a zirconium oxide, and a hafniumoxide, but example embodiments are not limited thereto.

A gate G1 of the transistor 111 is disposed on the first insulationlayer 10. The gate G1 may be a portion of a metal pattern. The gate G1overlaps the active A1. The gate G1 may serve as a mask in a process ofdoping the semiconductor pattern.

The second insulation layer 20 may be disposed on the first insulationlayer 10 to cover the gate G1. The second insulation layer 20 mayoverlap the pixels 110 (refer to FIG. 3) in common. The secondinsulation layer 20 may be an inorganic layer and/or an organic layerand have a single-layer or multi-layer structure. In the exampleembodiment, the second insulation layer 20 may be a single-layeredsilicon oxide layer.

A third insulation layer 30 may be disposed on the second insulationlayer 20, and in the example embodiment, the third insulation layer 30may be a single-layered silicon oxide layer.

A first connection electrode CNE1 may be disposed on the thirdinsulation layer 30. The first connection electrode CNE1 may beconnected to the connection signal line SCL through a contact hole CNT-1passing through the first, second, and third insulation layers 10, 20,and 30.

A fourth insulation layer 40 may be disposed on the third insulationlayer 30. The fourth insulation layer 40 may be a single-layered siliconoxide layer. A fifth insulation layer 50 may be disposed on the fourthinsulation layer 40. The fifth insulation layer 50 may be an organiclayer.

A second connection electrode CNE2 may be disposed on the fifthinsulation layer 50. The second connection electrode CNE2 may beconnected to the first connection electrode CNE1 through a contact holeCNT-2 passing through the fourth insulation layer 40 and the fifthinsulation layer 50.

A sixth insulation layer 60 may be disposed on the fifth insulationlayer 50 to cover the second connection electrode CNE2. The sixthinsulation layer 60 may be an organic layer.

The display element layer 100-3 including the light emitting element 112may be disposed on the circuit layer 100-2. The light emitting element112 may include a first electrode AE, a hole control layer HCL, a lightemitting layer EML, an electron control layer ECL, and a secondelectrode CE.

The first electrode AE may be disposed on the sixth insulation layer 60.The first electrode AE may be connected to the second connectionelectrode CNE2 through a contact hole CNT-3 passing through the sixthinsulation layer 60.

A pixel defining layer 70 may be disposed on the sixth insulation layer60 to cover a portion of the first electrode AE. An opening 70-OP isdefined in the pixel defining layer 70. The opening 70-OP of the pixeldefining layer 70 exposes at least a portion of the first electrode AE.

As illustrated in FIG. 4, the active area 100A (refer to FIG. 3) mayinclude a pixel area PXA and a non-pixel area NPXA disposed adjacent tothe pixel area PXA. The non-pixel area NPXA may surround the pixel areaPXA. In the example embodiment, the pixel area PXA may be defined incorrespondence to a portion of the first electrode AE exposed by theopening 70-OP.

The hole control layer HCL may be disposed on the first electrode AE.The hole control layer HCL may be disposed on the pixel area PXA and thenon-pixel area NPXA in common. The hole control layer HCL may include ahole transport layer and a hole injection layer.

The light emitting layer EML may be disposed on the hole control layerHCL. The light emitting layer EML may be disposed in an areacorresponding to the opening 70-OP. For example, the light emittinglayer EML may be separately provided on each of the pixels 110 (refer toFIG. 3). However, example embodiments are not limited thereto. Forexample, the light emitting layer EML may be disposed in the pixel areaPXA and the non-pixel area NPXA in common as the hole control layer HCL.When the light emitting layer EML is separately provided in each of thepixels, each of the light emitting layers EML may emit light having atleast one color of blue, red, and green. When the light emitting layerEML is disposed on the pixels 110 (refer to FIG. 3) in common, the lightemitting layer EML may provide blue light or white light.

The electron control layer ECL may be disposed on the light emittinglayer EML. The electron control layer ECL may include an electrontransport layer and further include an electron injection layer. Thehole control layer HCL and the electron control layer ECL may beprovided on the plurality of pixels in common by using an open mask.

The second electrode CE may be disposed on the electron control layerECL. The second electrode CE may have an integrated shape and bedisposed in the plurality of pixels PX (refer to FIG. 3) in common.

A capping layer 80 may be disposed on the second electrode CE to contactthe second electrode CE. The capping layer 80 may include an organicmaterial. The capping layer 80 may protect the second electrode CE froma following process, e.g., a sputtering process, and improve a lightemitting efficiency of the light emitting element 114. For example, thecapping layer 80 may have a refractive index greater than that of afirst inorganic layer 91, which will be described later, but exampleembodiments are not limited thereto. Alternatively, the capping layer 80may be omitted.

The encapsulation layer 100-4 may be disposed on the display elementlayer 100-3. The encapsulation layer 100-4 may include a first inorganiclayer 91, an organic layer 92, and a second inorganic layer 93. Thefirst inorganic layer 91 and the second inorganic layer 93 protect thedisplay element layer 100-3 from moisture/oxygen, and the organic layer92 may protect the display element layer 100-3 from foreign substancessuch as dust particles. Each of the first inorganic layer 91 and thesecond inorganic layer 93 may include a silicon nitride layer, a siliconoxynitride layer, a silicon oxide layer, a titanium oxide layer, or analuminum oxide layer. For example, the organic layer 92 may include anacrylic-based organic layer, but example embodiments are not limitedthereto.

In an example embodiment, an inorganic layer, e.g., a LiF layer, may befurther provided between the capping layer 80 and the first inorganiclayer 91. The LiF layer may enhance the light emitting efficiency of thelight emitting element 114.

FIG. 5 is a plan view of an example embodiment of a sensor of FIG. 2.

Referring to FIGS. 3 and 5, an active area 200A and a peripheral area200N may be defined on the sensor 200. The active area 200A may beactivated according to an electrical signal. For example, the activearea 200A may sense an input, e.g., a contact input signal and anon-contact input signal. The peripheral area 200N may surround theactive area 200A.

In an example embodiment, the active area 200A may have an area smallerthan that of the active area 100A of the display panel 100. For example,a portion of the active area 100A of the display panel 100 may overlapthe peripheral area 200N of the sensor 200. For example, a first portionof the active area 100A, which is adjacent to the third partial boundary100BAP3, and a second portion of the active area 100A, which is adjacentto the fourth partial boundary 100BAP4, may overlap the peripheral area200N of the sensor 200.

A boundary 200BA between the active area 200A and the peripheral area200N may include a first partial boundary 200BAP1 and a second partialboundary 200BAP2. The first partial boundary 200BAP1 and the secondpartial boundary 200BAP2 may overlap the active area 100A of the displaypanel 100. The first portion of the active area 100A may be surroundedby the first partial boundary 200BAP1 and the third partial boundary100BAP3. The second portion of the active area 100A may be surrounded bythe second partial boundary 200BAP2 and the fourth partial boundary100BAP4.

The sensor 200 may include a base insulation layer 200-1, first sensingelectrodes 210, second sensing electrodes 220, dummy patterns 230, andsensing lines 240 and 250. The first sensing electrodes 210, the secondsensing electrodes 220, and the dummy patterns 230 may be disposed inthe active area 200A, and the sensing lines 240 and 250 may be disposedin the peripheral area 200N. The sensing lines 240 and 250 may beelectrically connected to the plurality of sensing pads 160 through thecontact holes, respectively.

The sensor 200 may obtain information of an external input based on avariation of a mutual capacitance between the first sensing electrodes210 and the second sensing electrodes 220. The first sensing electrodes210 may be arranged in the first direction DR1, and each of the firstsensing electrodes 210 may extend in the second direction DR2. Thesecond sensing electrodes 220 may be arranged in the second directionDR2, and each of the second sensing electrodes 220 may extend in thefirst direction DR1.

The first sensing electrodes 210 may include first sensing patterns 211and first connection patterns 212. The first connection patterns 212 mayelectrically connect two adjacent first sensing patterns 211 to eachother. The second sensing electrodes 220 may include second sensingpatterns 221 and second connection patterns 222. The second connectionpatterns 222 may electrically connect two adjacent second sensingpatterns 221 to each other. For example, the two adjacent second sensingpatterns 221 may be connected to each other by two of the secondconnection patterns 222, but example embodiments are not limitedthereto.

Each of the first sensing patterns 211 may include a first portion 211a, a second portion 211 b, and a third portion 211 c, which areconnected to each other.

The first portion 211 a may extend in the second direction DR2. Thefirst portion 211 a may have one end connected to one first connectionpattern 212 and the other end connected to another first connectionpattern 212. The first portion 211 a may be referred to as a stemportion. Since the first connection patterns 212 and the first sensingpatterns 211 have one connected structure, the first connection patterns212 may be defined as one portion of the first portion 211 a.

The second portion 211 b may protrude from the first portion in thefirst direction DR1. For example, the second portion 211 b may protrudein a direction away from a central area of the first portion 211 a. Thefirst portion 211 a may be referred to as a projection portion.

The third portion 211 c may be provided in plurality. The third portions211 c may extend from the first portion 211 a in a first diagonaldirection DR3 a or a second diagonal direction DR4 a. The third portions211 c may have one portion extending in the first diagonal direction DR3a and the other portion extending in the second diagonal direction DR4a. The third portions 211 c may be referred to as branch portions.

The first diagonal direction DR3 a crosses each of the first and seconddirections DR1 and DR2. For example, the first diagonal direction DR3 amay be a direction between the first and second directions DR1 and DR2.The second diagonal direction DR4 a may cross the first diagonaldirection DR3 a. For example, the first diagonal direction DR3 a and thesecond diagonal direction DR4 a may be perpendicular to each other.

Each of the second sensing patterns 221 may have a shape correspondingto that of each of the first sensing patterns 211. Each of the secondsensing patterns 221 may surround at least two of the third portions 211c of each of the first sensing patterns 211 adjacent thereto.

However, example embodiments are not limited to the shape of each of thefirst sensing patterns 211 and the second sensing patterns 221. Each ofthe first sensing patterns 211 and the second sensing patterns 221 mayhave various shapes. For example, each of the first sensing patterns 211and the second sensing patterns 221 may have a diamond shape.

The sensing lines 240 and 250 may be electrically connected to the firstsensing electrodes 210 and the second sensing electrodes 220,respectively. The sensing lines 240 may be connected to the firstsensing electrodes 210, and the sensing lines 250 may have one portionconnected to left sides of one portion of the second sensing electrodes220, respectively, and the other portion connected to right sides of theother portion of the second sensing electrodes 220, respectively.However, the example embodiment in FIG. 5 is not limited to theconnection relationship between the sensing lines 240 and 250 and thefirst and second sensing electrodes 210 and 220.

According to an example embodiment, a partial sensing line 251(hereinafter, referred to as a first sensing line) of the sensing lines240 and 250 may overlap the active area 100A of the display panel 100.For example, when viewed in plane, a portion of the first sensing line251 may be disposed between the boundary 100BA and the first and secondsensing electrodes 210 and 220.

The first sensing line 251 may include a first portion 251P1, a secondportion 251P2, and a third portion 251P3. The first portion 251P1 andthe third portion 251P3 may be disposed in the peripheral area 100N ofthe display panel 100, and the second portion 251P2 may be disposed inthe active area 100A of the display panel 100. The second portion 251P2may be disposed between the third partial boundary 100BAP3 and the firstpartial boundary 200BAP1.

The first portion 251P1 may be electrically connected to the sensingelectrode, e.g., the second sensing electrode 220, the second portion251P2 may be electrically connected to the second sensing electrode 220through the first portion 251P1, and the third portion 251P3 may beelectrically connected to the second sensing electrode 220 through thefirst portion 251P1 and the second portion 251P2. The third portion251P3 may be connected to the sensing pads 160.

According to an example embodiment, at least a portion of the sensinglines 240 and 250 may be disposed to overlap the active area 100A. As aportion of the sensing lines 240 and 250 is formed to overlap the activearea 100A, an area on which the sensing lines 240 and 250 are disposedmay be secured or guaranteed even when a size of the peripheral area100N is reduced.

The dummy patterns 230 may be spaced apart from the first sensingpatterns 211 and the second sensing patterns 221. The dummy patterns 230may be provided through the same process as the first sensing patterns211 and the second sensing patterns 221. Thus, the dummy patterns 230may include the same material and have the same structure as the firstsensing patterns 211 and the second sensing patterns 221. The dummypatterns 230 may be referred to as auxiliary patterns, supplementarypatterns, sub-patterns, or boundary patterns.

The dummy patterns 230 may include a first dummy pattern 230 a and asecond dummy pattern 230 b. The first dummy pattern 230 a may bedisposed between the first sensing pattern 211 and the second sensingpattern 221. The second dummy pattern 230 b may be disposed between thesecond sensing patterns 221. For example, the second dummy pattern 230 bmay be disposed between two of the second sensing patterns 221, whichare adjacent to each other in the second direction DR2, to space the twoof the second sensing patterns 221 apart from each other.

The second dummy pattern 230 b may include a first boundary pattern 230b 1 and second boundary patterns 230 b 2. The first boundary pattern 230b 1 may have a diamond shape when viewed in plane. The second boundarypatterns 230 b 2 may be spaced apart from each other by the firstboundary pattern 230 b 1 therebetween. Each of the second boundarypatterns 230 b 2 may extend in the first direction DR1. The secondboundary patterns 230 b 2 may be connected to the first boundary pattern230 b 1 and the first dummy pattern 230 a, respectively.

As the first dummy pattern 230 a is disposed between the first sensingpatterns 211 and the second sensing patterns 221, a boundary areabetween the first sensing patterns 211 and the second sensing patterns221 may decrease in visibility. As the second dummy pattern 230 b isdisposed between the second sensing patterns 221, a boundary areabetween the second sensing patterns 221 may decrease in visibility.

One portion of the dummy patterns 230 may be a floating electrode thatis not electrically connected to the first sensing patterns 211 and thesecond sensing patterns 221. Alternatively, one portion of the dummypatterns 230 may be grounded. Another portion of the dummy patterns 230may be connected to the first sensing patterns 211 and the secondsensing patterns 221 to enhance or improve a sensing sensitivity of thesensor 200.

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 5.

Referring to FIGS. 5 and 6, the sensor 200 may include a base insulationlayer 200-1, a first conductive layer 200-2, a sensing insulation layer200-3, a second conductive layer 200-4, and a cover insulation layer200-5 in a cross-section view. The first conductive layer 200-2 may bedisposed on the base insulation layer 200-1. The sensing insulationlayer 200-3 may be disposed on the first conductive layer 200-2. Thesecond conductive layer 200-4 may be disposed on the sensing insulationlayer 200-3. The cover insulation layer 200-5 may be disposed on thesecond conductive layer 200-4.

The base insulation layer 200-1 may be an inorganic layer including oneof a silicon nitride, a silicon oxynitride, a silicon oxide, and thelike. Alternatively, the base insulation layer 200-1 may be an organiclayer including an epoxy resin, an acrylic resin, imide-based resin, orthe like. The base insulation layer 200-1 may have a single-layerstructure or a lamination structure that is laminated or stacked in thethird direction DR3.

The base insulation layer 200-1 may be provided directly on the displaypanel 100 (refer to FIG. 2). Alternatively, the base insulation layer200-1 may be one component of the display panel 100 (refer to FIG. 2).Alternatively, the base insulation layer 200-1 may be provided on aseparate base layer, and the base layer is coupled to the display panel100 (refer to FIG. 2) through an adhesive member.

Each of the first conductive layer 200-2 and the second conductive layer200-4 may have a single-layer structure or a multi-layer structure thatis laminated in the third direction DR3.

The single-layered conductive layer may include a metal layer or atransparent conductive layer. The metal layer may include molybdenum,silver, titanium, copper, aluminum, an alloy thereof, and the like. Thetransparent conductive layer may include a transparent conductive oxidesuch as an indium tin oxide (ITO), an indium zinc oxide (IZO), a zincoxide (ZnO), an indium zinc tin oxide (IZTO), and the like. Besides, thetransparent conductive layer may include a conductive polymer such asPEDOT, a metal nano-wire, graphene, or the like.

The multi-layered conductive layer may include multi-layered metallayers. The multi-layered metal layers may have, e.g., a three-layerstructure of titanium/aluminum/titanium. The multi-layered conductivelayer may include at least one metal layer and at least one transparentconductive layer.

Each of the first conductive layer 200-2 and the second conductive layer200-4 may include a portion of the first sensing patterns 211, the firstconnection patterns 212, the second sensing patterns 221, and the secondconnection patterns 222.

For example, the first conductive layer 200-2 may include secondconnection patterns 222 and 222 r. The second conductive layer 200-4 mayinclude the first sensing patterns 211, the second sensing patterns 221,the first connection patterns 212, and sensing lines 241, 251 r, 252 r,253 r, and 254 r. For example, the first sensing patterns 211, thesecond sensing patterns 221, the first connection patterns 212, and thesensing lines 241, 251 r, 252 r, 253 r, and 254 r may be disposed on thesame layer, e.g., the sensing insulation layer 200-3.

The first connection patterns 212 may be provided by the same process asthe first sensing patterns 211. Thus, the first connection patterns 212and the first sensing patterns 211 may include the same material andhave the same lamination structure as each other. For example, the firstconnection patterns 212 and the first sensing patterns 211 may have oneconnected structure or a unity structure. The second connection patterns222 and the second sensing patterns 221 may be disposed on differentlayers, respectively. Thus, the second sensing patterns 221 may bereferred to as bridge patterns.

The sensing line 241 may be connected to the first sensing electrode210, and the sensing lines 241, 251 r, 252 r, 253 r, and 254 r may beconnected to the second sensing electrodes 220, respectively. Among thesensing lines, the sensing line 251 r may be electrically connected tothe second sensing pattern 221 through the second connection pattern 222r.

At least one of the sensing insulation layer 200-3 and the coverinsulation layer 200-5 may include an inorganic layer. The inorganiclayer may include at least one of an aluminum oxide, a titanium oxide, asilicon oxide, a silicon oxynitride, a zirconium oxide, a hafnium oxide,and the like.

At least one of the sensing insulation layer 200-3 and the coverinsulation layer 200-5 may include an organic layer. The organic layermay include at least one of an acrylic-based resin, a methacrylic-basedresin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-basedresin, a urethane-based resin, a cellulose-based resin, a siloxane-basedresin, a polyimide-based resin, a polyamide-based resin, aperylene-based resin, or the like.

FIG. 7A is an enlarged plan view of area AA′ of FIG. 5. FIG. 7B is anenlarged plan view of area BB′ of FIG. 7A.

Referring to FIGS. 7A and 7B, each of the first sensing patterns 211,the second sensing patterns 221, and the dummy patterns 230 may have amesh structure (e.g., lattice structure). A boundary BD between thefirst sensing patterns 211, the second sensing patterns 221, and thedummy patterns 230 may be defined by removing a portion of the meshstructure.

In FIG. 7A, the boundary is illustrated by a solid line to illustratethe boundary BD. A portion obtained by removing a portion of the meshstructures in FIG. 7B may correspond to the boundary BD. For example,disconnected lines CTP obtained by removing a portion in the meshstructures may additionally prevent the boundary from being seen fromthe outside.

Referring to FIGS. 5, 7A, and 7B, the sensor 200 may include a pluralityof sensing units 200U. The plurality of sensing units 200U may bedisposed in the active area 200A. Each of the plurality of sensing units200U may include a portion of each of two of first sensing patterns 211,a portion of each of two of the second sensing patterns 221, one firstconnection pattern 212, the second connection patterns 222, and thedummy patterns 230.

In each of the plurality of sensing units 200U, the third portions 211 c(e.g., branch portions) may extend in a direction away from the secondconnection patterns 222 (e.g., bridge patterns). In each of theplurality of sensing units 200U, four third portions 211 c may bedisposed. The two of the third portions 211 c may extend in the firstdiagonal direction DR3 a, and the rest two of the third portions 211 cmay extend in the second diagonal direction DR4 a.

FIG. 8A is an enlarged plan view of area CC′ in FIG. 5 illustrating anexample embodiment of sensing lines and sensing electrodes of FIG. 5.

Referring to FIGS. 5 and 8A, the first sensing line 251, a secondsensing line 252, a third sensing line 253, and a fourth sensing line254 are illustrated. One portion of each of the first, second, third,and fourth sensing lines 251, 252, 253, and 254 may be disposed betweenthe first partial boundary 200BAP1 and the third partial boundary100BAP3. The first sensing line 251, the second sensing line 252, thethird sensing line 253, and the fourth sensing line 254 may besequentially arranged in a direction away from the first partialboundary 200BAP1. The first sensing line 251 may include the firstportion 251P1, the second portion 251P2, and the third portion 251P3,and the second sensing line 252 may include the fourth portion 252P1,the fifth portion 252P2, and the sixth portion 252P3.

The first portion 251P1, the third portion 251P3, the fourth portion252P1, and the sixth portion 252P3 may be formed in the first conductivelayer 200-2 (refer to FIG. 6), and the second portion 251P2 and thefifth portion 252P2 may be formed in the second conductive layer 200-4(refer to FIG. 6).

The second portion 251P2 and the fifth portion 252P2 may be disposedbetween the first partial boundary 200BAP1 and the third partialboundary 100BAP3 and overlap the active area 100A (refer to FIG. 3) ofthe display panel 100 (refer to FIG. 3).

Hereinafter, the second portion 251P2 is referred to as a firstconnection portion 251P2 of the first sensing line 251, and the fifthportion 252P2 is referred to as a second connection portion 252P2 of thesecond sensing line 252. For example, one portion of the third sensingline 253 overlapping the active area 100A (refer to FIG. 3) is referredto as a third connection portion 253P2, and one portion of the fourthsensing line 254 overlapping the active area 100A (refer to FIG. 3) isreferred to as a fourth connection portion 254P2.

The second sensing line 252 may be connected to one sensing electrode,which is more away from the sensing pads 160 (refer to FIG. 3) thananother sensing electrode connected to the first sensing line 251. Thus,the second sensing line 252 may have a length greater than that of thefirst sensing line 251. The second connection portion 252P2 may have alength less than that of the first connection portion 251P2 and aresistance value less than that of the first connection portion 251P2.Thus, the difference between a total resistance value of the firstsensing line 251 and a total resistance value of the second sensing line252 may be reduced by the first connection portion 251P2 and the secondconnection portion 252P2.

FIG. 8B is an enlarged plan view of area CC′ in FIG. 5 illustratinganother example embodiment of the sensing lines and the sensingelectrodes of FIG. 5.

Referring to FIG. 8B, a sensing unit 211U-A adjacent to the firstpartial boundary 200BAP1 may have a size less than that of anothersensing unit 200U. A portion of dummy patterns in the sensing unit211U-A may be omitted to reduce a sensing sensitivity between thesensing unit 211U-A and the sensing unit 200U. Thus, an area occupied bya first sensing pattern 211-A in the sensing unit 211U-A may increasemore than a case when the dummy pattern is not omitted. As a result, thereduced sensing sensitivity in the sensing unit 211U-A may becompensated.

For example, a first dummy pattern 230 a may be disposed between a firstsensing pattern 211-B and a second sensing pattern 221 in the sensingunit 200U. However, a dummy pattern may not be disposed between thesecond sensing pattern 221 and a third portion 211C-A of the firstsensing pattern 211-A in the sensing unit 211U-A. For example, the firstsensing pattern 211-A may extend to the second sensing pattern 221without any dummy pattern between the second sensing pattern 221 and thethird portion 211C-A of the first sensing pattern 211-A in the sensingunit 211U-A. Thus, the third portion 211C-A of the first sensing pattern211-A may have a size greater than that of a third portion 211C of afirst sensing pattern 211-B

FIG. 9 is an enlarged plan view of area DD′ of FIG. 8A. FIG. 10 is anenlarged plan view of area EE′ of FIG. 8A.

Referring to FIGS. 9 and 10, each of the first, second, third, andfourth connection portions 251P2, 252P2, 253P2, and 254P2 overlappingthe active area 100A may have a mesh structure (e.g., latticestructure). Thus, although the first, second, third, and fourthconnection portions 251P2, 252P2, 253P2, and 254P2 overlap the activearea 100A, a probability of the first, second, third, and fourthconnection portions 251P2, 252P2, 253P2, and 254P2 being seen from theoutside may be minimized due to the mesh structure thereof.

When the first sensing line 251 is described as an example, the firstportion 251P1 and the third portion 251P3 may be disposed on the samelayer, and the first connection portion 251P2 (e.g., second portion) maybe disposed on a different layer from the same layer, on which the firstportion 251P1 and the third portion 251P3 are disposed. The firstportion 251P1 and the first connection portion 251P2 may be electricallyconnected to each other through a contact hole provided in the sensinginsulation layer 200-3 (refer to FIG. 6), and the third portion 251P3and the first connection portion 251P2 may be electrically connected toeach other through a contact hole provided in the sensing insulationlayer 200-3 (refer to FIG. 6).

FIG. 11A is an enlarged plan view of area FF′ in FIG. 8A illustrating anexample embodiment of the sensing lines of FIG. 8A.

Referring to FIG. 11A, boundaries BD1, BD2, BD3, BD4, and BD5 areillustrated by a solid line to clearly illustrate the boundaries BD1,BD2, BD3, BD4, and BD5 between the first sensing pattern 211 and thefirst, second, third, and fourth connection portions 251P2, 252P2,253P2, and 254P2.

In an example embodiment, pitches between the boundaries BD1, BD2, BD3,BD4, and BD5 may be the same as each other. For example, a first pitchPC1 between the first boundary BD1 and the second boundary BD2 may bethe same as a second pitch PC2 between the second boundary BD2 and thethird boundary BD3. The first connection portion 251P2 may have a widthcorresponding to the first pitch PC1, and the second connection portion252P2 may have a width corresponding to the second pitch PC2. Thus, thewidth of the first connection portion 251P2 may be the same as that ofthe second connection portion 252P2.

FIG. 11B is an enlarged plan view of an area corresponding to area FF′in FIG. 8A illustrating another example embodiment of the sensing linesof FIG. 8A.

Referring to FIG. 11B, a dummy electrode 270 may be further providedbetween the first connection portion 251P2 and the first sensing pattern211. The dummy electrode 270 may be spaced apart from the first sensingpattern 211 by a boundary BD0 therebetween.

The dummy electrode 270, as a floating electrode, may not beelectrically connected to the first connection portion 251P2 and thefirst sensing pattern 211. A parasitic capacitance generated between thefirst sensing pattern 211 and the first connection portion 251P2 may bereduced by the dummy electrode 270.

For example, the dummy electrode 270 is exemplarily disposed onlybetween the first connection portion 251P2 and the first sensing pattern211 in FIG. 11B, but example embodiments are not limited thereto. Forexample, a dummy electrode may be further provided between the firstconnection portion 251P2 and the second connection portion 252P2.

FIG. 11C is an enlarged plan view of an area corresponding to area FF′in FIG. 8A illustrating another example embodiment of the sensing linesof FIG. 8A.

Referring to FIG. 11C, pitches between boundaries BD1 a, BD2 a, BD3 a,and BD4 a may be different from each other. A first pitch PC1 a betweenthe first boundary BD1 a and the second boundary BD2 a, a second pitchPC2 a between the second boundary BD2 a and the third boundary BD3 a,and a third pitch PC3 a between the third boundary BD3 a and the fourthboundary BD4 a may be defined. The third pitch PC3 a may be greater thaneach of the first pitch PC1 a and the second pitch PC2 a, and the secondpitch PC2 a may be greater than the first pitch PC1 a.

A width of a first connection portion 251 aP2 may correspond to thefirst pitch PC1 a, a width of a second connection portion 252 aP2 maycorrespond to the second pitch PC2 a, and a width of a third connectionportion 253 aP2 may correspond to the third pitch PC3 a. Thus, thewidths of the first, second, third, and fourth connection portions 251aP2, 252 aP2, 253 aP2, and 254 aP2 may be different from each other.

The connection portion may have a width and a resistance value that areinversely proportional to each other. Thus, a resistance value of thefirst connection portion 251 aP2 may be greater than that of the secondconnection portion 252 aP2, and the width of the first connectionportion 251 aP2 may be less than that of the second connection portion252 aP2. According to an example embodiment, the difference betweentotal resistance values of the first, second, third, and fourth sensinglines 251, 252, 253, and 254 (refer to FIG. 5) may be reduced byadjusting the widths of the first, second, third, and fourth connectionportions 251 aP2, 252 aP2, 253 aP2, and 254 aP2.

FIG. 11D is an enlarged plan view of an area corresponding to area FF′in FIG. 8A illustrating another example embodiment of the sensing linesof FIG. 8A.

Referring to FIG. 11D, a first sensing pattern 211 and first, second,third, and fourth connection portions 251 bP2, 252 bP2, 253 bP2, and 254bP2 are illustrated. Each of the first sensing pattern 211 and thefirst, second, third, and fourth connection portions 251 bP2, 252 bP2,253 bP2, and 254 bP2 may have a mesh structure (e.g., latticestructure).

Mesh lines of the first, second, third, and fourth connection portions251 bP2, 252 bP2, 253 bP2, and 254 bP2 may have widths different fromeach other. For example, a width WT1 of a mesh line MS1 constituting thefirst connection portion 251 bP2 may be less than a width WT2 of a meshline MS2 of the second connection portion 252 bP2. In this case, thefirst connection portion 251 bP2 may have a resistance value greaterthan that of the second connection portion 252 bP2. Thus, the differencebetween a total resistance value of the first sensing line 251 (refer toFIG. 5) and a total resistance value of the second sensing line 252(refer to FIG. 5) may be reduced due to the difference between thewidths of the first connection portion 251 bP2 and the second connectionportion 252 bP2.

FIG. 12 is a plan view of another example embodiment of the sensor ofFIG. 2. FIG. 13 is a cross-sectional view taken along line II-II′ ofFIG. 12.

Referring to FIGS. 3, 12, and 13, an active area 200A-A and a peripheralarea 200N-A may be defined on a sensor 200-A. In an example embodiment,the active area 200A-A may have the substantially same area as that ofthe active area 100A of the display panel 100. Thus, a boundary 200BA-Abetween the active area 200A-A and the peripheral area 200N-A maycorrespond to the boundary 100BA of the display panel 100.

One portion of each of partial sensing lines 251 r-A, 252-A, 253-A,254-A, and 255-A of sensing lines 240-A and 250-A may be disposed in theactive area 100A of the display panel 100.

The one portion of each of the sensing lines 251 r-A, 252-A, 253-A,254-A, and 255-A may be disposed in the active area 200A-A. In across-sectional view, the one portion of each of the sensing lines 251r-A, 252-A, 253-A, 254-A, and 255-A may be disposed below the firstsensing patterns 211 and the second sensing patterns 221. For example,the one portion of each of the sensing lines 251 r-A, 252-A, 253-A,254-A, and 255-A is disposed at the different level from the firstsensing patterns 211 and the second sensing patterns 221. For example,the one portion of each of the sensing lines 251 r-A, 252-A, 253-A,254-A, and 255-A may be disposed below the first sensing patterns 211and the second sensing patterns 221.

Since the one portion of each of the sensing lines 251 r-A, 252-A,253-A, 254-A, and 255-A are disposed in a different layer from the firstsensing patterns 211 and the second sensing patterns 221, a size of eachof the first sensing patterns 211 and the second sensing patterns 221may not be reduced in a specific area. The specific area represents anarea on which the one portion of each of the sensing lines 251 r-A,252-A, 253-A, 254-A, and 255-A are disposed. Thus, although the oneportion of each of the sensing lines 251 r-A, 252-A, 253-A, 254-A, and255-A are disposed in the active area 200A-A, a variation of a sensingsensitivity of the sensor 200-A may be minimized, because the size ofeach of the first sensing patterns 211 and the second sensing patterns221 is not reduced in the specific area. The one portion of each of thesensing lines 251 r-A, 252-A, 253-A, 254-A, and 255-A may be referred toas connection portions.

A first conductive layer 200-2A may include second connection patterns222 and the sensing lines 251 r-A, 252-A, 253-A, 254-A, and 255-A. Asecond conductive layer 200-4A may include first sensing patterns 211,second sensing patterns 221 and 221-A, and first connection patterns212. For example, the first sensing patterns 211, the second sensingpatterns 221 and 221-A, and the first connection patterns 212 may bedisposed on a first layer, e.g., a sensing insulation layer 200-3, andthe second connection patterns 222 and the sensing lines 251 r-A, 252-A,253-A, 254-A, and 255-A may be disposed on a second layer different fromthe first layer, e.g., a base insulation layer 200-1.

FIG. 14 is a plan view of another example embodiment of the sensor ofFIG. 2.

Referring to FIGS. 3 and 14, a sensor 200-B may include first sensingelectrodes 210, second sensing electrodes 220, dummy patterns 230, andsensing lines 240 and 250.

According to an example embodiment, partial sensing lines 250A(hereinafter, referred to as first sensing lines) of the sensing lines240 and 250 may overlap the active area 100A of the display panel 100.When viewed in plane, one portion of each of the partial sensing lines250A may be disposed between a boundary 100BA and first and secondsensing electrodes 210 and 220. Another partial sensing line 250N(hereinafter, referred to as a second sensing line) of the sensing lines240 and 250 may overlap the peripheral area 100N of the display panel100. For example, one portion of the second sensing line 250N may bespaced apart from the one portion of each of the first sensing lines250A by a third partial boundary 100BAP3 therebetween.

According to an example embodiment, the partial sensing lines of thesensing lines 240 and 250 may be formed to overlap the active area 100Aof the display panel 100. Thus, although a size of the peripheral area100N of the display panel 100 is reduced, an area on which the sensinglines 240 and 250 are disposed may be secured.

According to the example embodiment, the one portion of the sensingline, which is electrically connected to the sensing electrode, mayoverlap the active area of the display panel. Although the size of theperipheral area of the display panel is reduced, the area on which thesensing line is disposed may secure a sufficient area by forming the oneportion of the sensing line to overlap the active area of the displaypanel. For example, as the resistance values of the portions of thesensing lines, which overlap the active area of the display panel, areadjusted, the difference between the resistance values of the sensinglines may be reduced.

Although the example embodiments of the present disclosure have beendescribed, it is understood that the present disclosure should not belimited to these example embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present disclosure as hereinafter claimed.Hence, the real protective scope of the present disclosure shall bedetermined by the technical scope of the accompanying claims.

What is claimed is:
 1. An electronic device comprising: a display panelhaving an active area in which a plurality of pixels are disposed and aperipheral area disposed around the active area; a plurality of sensingelectrodes disposed in the active area; and a first sensing lineconnected to one of the plurality of sensing electrodes and comprising afirst portion disposed in the peripheral area, a second portionextending from the first portion and disposed in the active area, and athird portion extending from the second portion and disposed in theperipheral area.
 2. The electronic device of claim 1, further comprisinga second sensing line connected to another of the plurality of sensingelectrodes and comprising a fourth portion disposed in the peripheralarea, a fifth portion extending from the fourth portion and disposed inthe active area, and a sixth portion extending from the fifth portionand disposed in the peripheral area, wherein the fourth portion of thesecond sensing line in the active area is closer to the peripheral areathan the second portion of the first sensing line in the active areawhen viewed in plane.
 3. The electronic device of claim 2, wherein thesecond portion of the first sensing line in the active area has a lengthgreater than that of the fifth portion of the second sensing line in theactive area.
 4. The electronic device of claim 2, wherein the secondportion of the first sensing line in the active area has a width lessthan that of the fifth portion of the second sensing line in the activearea.
 5. The electronic device of claim 2, wherein the second portion ofthe first sensing line in the active area has resistance greater thanthat of the fifth portion of the second sensing line in the active area.6. The electronic device of claim 2, wherein each of the second portionof the first sensing line in the active area and the fifth portion ofthe second sensing line in the active area has a mesh structure.
 7. Theelectronic device of claim 6, wherein a mesh line of the second portionof the first sensing line in the active area has a width equal to orless than that of a mesh line of the fifth portion of the second sensingline in the active area.
 8. The electronic device of claim 1, whereineach of the plurality of sensing electrodes comprises a plurality ofsensing patterns and a plurality of connection patterns, and the secondportion of the first sensing line in the active area and the pluralityof sensing patterns are disposed on a same layer and comprise a samematerial.
 9. The electronic device of claim 8, further comprising adummy electrode disposed between the second portion of the first sensingline in the active area and the plurality of sensing patterns.
 10. Theelectronic device of claim 1, wherein each of the plurality of sensingelectrodes comprises a plurality of sensing patterns and a plurality ofconnection patterns, and the second portion of the first sensing line inthe active area is disposed at a different level from the plurality ofsensing patterns in a cross-sectional view.
 11. The electronic device ofclaim 1, wherein a boundary is disposed between the active area and theperipheral area, and the boundary comprises a partially curved boundary.12. The electronic device of claim 11, wherein the second portion of thefirst sensing line in the active area is spaced apart from theperipheral area by the partially curved boundary therebetween whenviewed in plane.
 13. The electronic device of claim 11, furthercomprising a second sensing line connected to another of the pluralityof sensing electrodes and spaced apart from the second portion by thepartially curved boundary therebetween.
 14. The electronic device ofclaim 1, wherein the display panel is bent with respect to: a firstbending axis extending in a first direction; a second bending axisextending in the first direction and spaced apart from the first bendingaxis in a second direction intersecting the first direction; a thirdbending axis extending in the second direction; and a fourth bendingaxis extending in the second direction and spaced apart from the thirdbending axis in the first direction, wherein the active area overlapsthe first bending axis, the second bending axis, the third bending axis,and the fourth bending axis when viewed in plane.
 15. An electronicdevice comprising: a display panel having an active area configured todisplay an image, a peripheral area disposed around the active area, anda partially curved boundary between the active area and the peripheralarea; and a sensor comprising a plurality of sensing electrodes disposedin the active area and a plurality of sensing lines electricallyconnected to the plurality of sensing electrodes, respectively, wherein:the plurality of sensing lines comprise a first sensing lineelectrically connected to one of the plurality of sensing electrodes,and a connection portion of the first sensing line is spaced apart fromthe peripheral area by the partially curved boundary therebetween whenviewed in plane.
 16. The electronic device of claim 15, wherein: theplurality of sensing lines further comprise a second sensing lineelectrically connected to another of the plurality of sensingelectrodes, a connection portion of the second sensing line is disposedbetween the partially curved boundary and the connection portion of thefirst sensing line when viewed in plane, and the connection portion ofthe second sensing line has a resistance value less than that of theconnection portion of the first sensing line.
 17. The electronic deviceof claim 16, wherein the connection portion of the first sensing linehas a length greater than that of the connection portion of the secondsensing line.
 18. The electronic device of claim 16, wherein theconnection portion of the first sensing line has a width less than thatof the connection portion of the second sensing line.
 19. The electronicdevice of claim 16, wherein each of the connection portion of the firstsensing line and the connection portion of the second sensing line has amesh structure, and a mesh line of the connection portion of the firstsensing line has a width equal to or less than that of a mesh line ofthe connection portion of the second sensing line.
 20. The electronicdevice of claim 16, wherein each of the plurality of sensing electrodescomprises a plurality of sensing patterns and a plurality of connectionpatterns, and the connection portion of the first sensing line, theconnection portion of the second sensing line, and the plurality ofsensing electrodes are disposed on a same layer or are disposed atdifferent levels in a cross-sectional view.